Title:
RESIN HOUSING
Document Type and Number:
Japanese Patent JP2018047583
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin housing which has no risk of lowering appearance quality.SOLUTION: A resin housing is provided with at least a resin front housing (housing body portion) 31 in which a thick portion 31a and a thin portion 31b thinner than the thick portion 31a are integrally formed with each other, where in the thick portion 31a, a pattern portion 50 is formed in a visible portion T facing the visible side. The thick portion 31a has an engagement portion 31d with which a screw S provided so as to pass a through hole portion 32d is engaged, at a position corresponding to the through hole portion 32d provided on a rear side housing (case member) 32.SELECTED DRAWING: Figure 1
Inventors:
IIDA HIROSHI
Application Number:
JP2016183581A
Publication Date:
March 29, 2018
Filing Date:
September 21, 2016
Export Citation:
Assignee:
NIPPON SEIKI CO LTD
International Classes:
B29C33/42; B60K37/02; B60K37/04
Domestic Patent References:
| JPH08207075A | 1996-08-13 | |||
| JP2007144934A | 2007-06-14 | |||
| JPH0976247A | 1997-03-25 | |||
| JPS63281818A | 1988-11-18 | |||
| JPS6369616A | 1988-03-29 |
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