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Title:
RESIN COMPOSITION FOR ADHESION, LAMINATE AND ORIENTED FILM
Document Type and Number:
Japanese Patent JP3671625
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain a resin composition for adhesion excellent in adhesive strength to various resins after orientation, and further excellent in extrusion formability of a product such as a film, a sheet and a blow molded product, and further to obtain a laminate and the oriented film of the laminate.
SOLUTION: This resin composition for adhesion comprises (a) 1-50 wt.% modified and hydrogenated block copolymer obtained by hydrogenating a block copolymer of a vinyl aromatic compound and a conjugated diene compound, modifying the hydrogenated copolymer with an unsaturated carboxylic acid or a derivative thereof so that the content of the unsaturated carboxylic acid or the derivative thereof may be 0.01-20 wt.%, (b) 50-99 wt.% adhesion-imparting agent, and further (c) 10-1,000 pts.wt. ethylenic polymer having 0.05-50 g/10 min MFR, 0.850-0.950 g/cm3 density based on 100 pts.wt. of the total amount of the components (a) and (b).


Inventors:
Mutsuko Ikeda
Application Number:
JP29701597A
Publication Date:
July 13, 2005
Filing Date:
October 29, 1997
Export Citation:
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Assignee:
Mitsubishi Chemical Corporation
International Classes:
B32B27/00; C08L23/04; C08L53/00; C09J123/04; C09J153/00; (IPC1-7): C09J153/00; B32B27/00; C09J123/04
Domestic Patent References:
JP3007746A
JP10279774A
JP10286870A
JP4096959A
JP56104978A
JP55013719A
JP6322346A
JP10265751A
JP10264323A
Foreign References:
US5070143
Attorney, Agent or Firm:
Michiteru Soga
Yoshio Kobayashi
Yutaka Ikeya
Hidetoshi Furukawa
Suzuki Kenchi
Masahisa Hase
Tetsuo Kuroiwa