Title:
樹脂組成物及び接着複合体
Document Type and Number:
Japanese Patent JP5835231
Kind Code:
B2
Abstract:
A resin composition, preferably an adhesive composition, comprising a polyether polyamide elastomer capable of being strongly bended with a polyimide resin, preferably strongly bended through an easy process to form an interface between the polyimide resin and the composition, and a bonded composite having the resin composition and a polyimide resin which together form an interface to be bonded with each other. A resin composition for forming an interface together with a polyimide resin for bonding, wherein the resin composition comprises a polyether polyamide elastomer (component R) obtained by subjecting a specific aminocarboxylic acid compound A1 and/or lactam compound A2, polyether compound B, and dicarboxylic acid compound C to polymerization, wherein the content of the component R in the resin composition is 80 to 100% by weight.
Inventors:
Yuma Irisa
Shuichi Maeda
Shuichi Maeda
Application Number:
JP2012552664A
Publication Date:
December 24, 2015
Filing Date:
December 28, 2011
Export Citation:
Assignee:
Ube Industries,Ltd.
International Classes:
C09J177/02; B32B1/08; B32B27/00
Domestic Patent References:
| JP2000208564A | 2000-07-28 | |||
| JP2000085007A | 2000-03-28 |
Foreign References:
| WO2009057805A1 | 2009-05-07 |
Attorney, Agent or Firm:
Patent business corporation Tsukuni
Hajime Tsukuni
Yasuo Yanagibashi
Keiko Ozawa
Yoko Tanaka
Kurino Yuriko
Hajime Tsukuni
Yasuo Yanagibashi
Keiko Ozawa
Yoko Tanaka
Kurino Yuriko
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