To provide a resin composition having low thermal expansion, high heat resistance, low-temperature melting property and flexibility in a film state, and to provide an adhesive for electronic parts.

The resin composition contains at least (A) an elastomer selected from polyimide, polyetherimide and polyamideimide, (B) a compound having a maleimide group, and (C) a compound having an allyl group or a compound having a vinylbenzyl group. The elastomer of the above (A) has a glass transition temperature (Tg) of 110°C to 270°C; and at least one kind of compound in the compounds of (B) and (C) has an alkylene group in the main chain of the compound or between functional groups of the compound.