Title:
RESIN COMPOSITION, ADHESIVE ENCAPSULATION FILM, AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2015071673
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition suitable for an adhesive encapsulation film having high adhesiveness and durability while maintaining a good moisture barrier property.SOLUTION: Provided is a resin composition comprising a block copolymer X containing a vinyl aromatic polymer block A and a block B of a polymer containing isobutylene as a main component, polyisobutylene, and a tackifier resin having a carbon double bond content of 1.6% or more and 50.0% or less. A content of the tackifier resin in the total solid content is 30 mass% or more.
Inventors:
TATSUMI TOMOKO
ANDO MASATO
TANAKA TOSHIYUKI
KARASAWA TAMAE
KASAI TETSUO
ANDO MASATO
TANAKA TOSHIYUKI
KARASAWA TAMAE
KASAI TETSUO
Application Number:
JP2013207332A
Publication Date:
April 16, 2015
Filing Date:
October 02, 2013
Export Citation:
Assignee:
MITSUBISHI CHEM CORP
International Classes:
C08L53/00; B32B27/00; B32B27/30; C08L23/18; C08L91/00; C08L93/04; C08L99/00; C09J7/00; C09J153/00; C09J201/02
Foreign References:
| WO2011062167A1 | 2011-05-26 | |||
| WO2013031656A1 | 2013-03-07 |
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