樹脂組成物、接着シートおよび多層基板

Title:

樹脂組成物、接着シートおよび多層基板

Document Type and Number:

Japanese Patent JP7180324

Kind Code:

B2

Abstract:

To provide a resin composition having enhanced processability while enhancing adhesive strength with a metal such as copper by reducing dielectric constant and dielectric loss tangent while maintaining sufficient heat resistance and mechanical strength of polyimide, and adding heat curability to reduce melting viscosity during heating.SOLUTION: There is provided a resin composition containing at least (A) a polyimide resin and (B) an epoxy resin, in which the (B) epoxy resin contains at least (B-1) an epoxy resin having an alkyl group with 9 or more carbon atoms, and content of the (B-1) is 30 mass% to 70 mass% based on whole of the (B) epoxy resin.SELECTED DRAWING: None

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Inventors:

Akira Shimada
Yoshiko Tateoka
Kazuyuki Matsumura

Application Number:

JP2018223555A

Publication Date:

November 30, 2022

Filing Date:

November 29, 2018

Export Citation:

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Assignee:

TORAY INDUSTRIES,INC.

International Classes:

C08L79/08; B32B17/10; B32B18/00; C08G73/10; C08L63/00; C09J7/30; H05K1/03

Domestic Patent References:

JP2012015311A
JP2008009419A
JP2016023293A
JP2006307159A
JP2016176009A
JP2014132066A
JP201225839A
JP201314638A

Foreign References:

WO2018180548A1
WO2018097292A1

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