Title:
RESIN COMPOSITION, ADHESIVE SHEET, PREPREG, AND LAMINATE
Document Type and Number:
Japanese Patent JP2023112261
Kind Code:
A
Abstract:
To provide a thermosetting resin composition that can achieve both of low transmission loss and heat-dissipating performance under similar curing conditions to those of conventional high-frequency substrate materials, an adhesive sheet, a prepreg, and a laminate.SOLUTION: A thermosetting resin composition comprises a maleimide compound having at least two maleimide groups in one molecule, a polyphenylene ether compound having at least two reactive organic groups in one molecule, a curing accelerator, and an inorganic filler. The inorganic filler is aluminum oxide of low sodium type, and the aluminum oxide of low sodium type has an Na+ion content of 10 ppm or less.SELECTED DRAWING: Figure 2
Inventors:
KUBOYAMA NORIHITO
IMAI SHOTA
IMAI SHOTA
Application Number:
JP2022013928A
Publication Date:
August 14, 2023
Filing Date:
February 01, 2022
Export Citation:
Assignee:
RISHO KOGYO KK
International Classes:
C08L71/08; B32B5/10; B32B15/088; B32B27/00; B32B27/04; B32B27/20; B32B27/34; C08F2/44; C08J5/24; C08K3/013; C08K3/22; C08K3/28; C08K3/38; C08K5/14; C09J7/35; C09J11/04; C09J11/06; C09J171/12; C09J179/08
Attorney, Agent or Firm:
▲吉▼川 俊雄
Hiroshi Ichikawa
Hiroshi Ichikawa
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