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Title:
RESIN COMPOSITION, AND ADHESIVE, ADHESIVE SHEET OR ADHESIVE TAPE USING THE SAME
Document Type and Number:
Japanese Patent JP2007302860
Kind Code:
A
Abstract:

To provide a resin composition having good adhesiveness and curable by heat or light; and to provide an adhesive, an adhesive sheet or an adhesive tape using the resin composition.

The resin composition contains at least (A) a copolymer which contains (a) a polyamide and (b) a (meth)acrylate, and also contains at least one kind or more of functional groups selected from a carboxy group, a hydroxy group, a cyano group, a dimethylamino group, a pyridyl group and a tetramethylpiperidyl group in one of the components (a) and (b), (B) a monomer having at least one radically polymerizable double bond in one molecule, and (C) a polymerization initiator forming a radical by heat or light. The adhesive, adhesive sheet or adhesive tape is obtained by using the resin composition.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
YOSHIKAWA TORU
YAMASHITA YUKIHIKO
Application Number:
JP2006207930A
Publication Date:
November 22, 2007
Filing Date:
July 31, 2006
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08F287/00; C08F2/44; C09J4/00; C09J7/00; C09J9/02; C09J11/06; C09J133/00; C09J153/00; C09J177/00
Domestic Patent References:
JPS58125773A1983-07-26
JP2001181591A2001-07-03