To provide a resin composition having good adhesiveness and curable by heat or light; and to provide an adhesive, an adhesive sheet or an adhesive tape using the resin composition.
The resin composition contains at least (A) a copolymer which contains (a) a polyamide and (b) a (meth)acrylate, and also contains at least one kind or more of functional groups selected from a carboxy group, a hydroxy group, a cyano group, a dimethylamino group, a pyridyl group and a tetramethylpiperidyl group in one of the components (a) and (b), (B) a monomer having at least one radically polymerizable double bond in one molecule, and (C) a polymerization initiator forming a radical by heat or light. The adhesive, adhesive sheet or adhesive tape is obtained by using the resin composition.
COPYRIGHT: (C)2008,JPO&INPIT
YAMASHITA YUKIHIKO
JPS58125773A | 1983-07-26 | |||
JP2001181591A | 2001-07-03 |