To provide a resin composition exhibiting excellent adhesion to an untreated polyolefin-based resin film, sheet or molded product, hardly providing sticky feeling to a coated film, and having excellent heat-sealability at low temperature.

The resin composition is obtained by reacting (A) a modified resin obtained by modifying at least a part of (a) a styrenic elastomer with a functional group, with (C) a copolymerizable monomer comprising a monomer having an α,β-monoethylenic unsaturated group and other monomers copolymerizable therewith, regulated so that the weight ratio (A)/(C) may be (1/9)-(9/1), or by reacting a mixture of (A) the modified resin and (B) a polyolefin resin, with (C) the copolymerizable monomer comprising the monomer having the α,β-monoethylenic unsaturated group and other monomers copolymerizable therewith, regulated so that the weight ratio ((A)+(B))/(C) may be (1/9)-(9/1).