Title:
RESIN COMPOSITION, B-STAGE FILM, LAMINATED FILM, AND MULTILAYER SUBSTRATE
Document Type and Number:
Japanese Patent JP2012041510
Kind Code:
A
Abstract:
To provide a resin composition which can easily be obtained, and can enhance the flatness of a surface when being laminated on a member having holes or irregularities on the surface.
The resin composition includes an epoxy resin, a curing agent, and a filler. The filler has been surface-treated with a silane coupling agent having a vinyl group. The content of the filler is ≥160 pts.wt and ≤900 pts.wt based on 100 pts.wt of the total of the epoxy resin and the curing agent.
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Inventors:
DEGUCHI HIDEHIRO
Application Number:
JP2010186493A
Publication Date:
March 01, 2012
Filing Date:
August 23, 2010
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08G59/18; B32B27/20; B32B27/26; B32B27/38; C08K3/36; C08K9/06; C08L63/00; H05K1/03; H05K3/46; B32B15/08
Domestic Patent References:
| JP2005325210A | 2005-11-24 | |||
| JP2008130796A | 2008-06-05 | |||
| JP2000239355A | 2000-09-05 |
Foreign References:
| WO2011149018A1 | 2011-12-01 |
Attorney, Agent or Firm:
宮▲崎▼ 主税
Table of contents Makoto
Tomoyuki Ishimura
Kazutoshi Nakayama
Table of contents Makoto
Tomoyuki Ishimura
Kazutoshi Nakayama