Title:
RESIN COMPOSITION BLENDED WITH DESICCANT, MOLDED RESIN ARTICLE THEREFROM, AND MOLDING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP3949956
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition blended with a desiccant that can furnish drying properties to a packaging material, a packaging container, etc., or to a content packaged by a packaging material, a packaging container, etc., to provide a molded resin article therefrom, and to provide a molding method therefor.
SOLUTION: This resin composition blended with a desiccant that is obtained by mixing a base resin, a molecular sieve, and an additive having a polar group to enhance affinity between the molecular sieve and the base resin is used for preparing a molded article. The molding can be performed at a high speed at a temperature of ≤300°C.
Inventors:
Oikawa Takuji
Tatsuya Ogawa
Shinichi Koizumi
Saori Takahashi
Yasushi Fuchida
Hiroshi Fujii
Tatsuya Ogawa
Shinichi Koizumi
Saori Takahashi
Yasushi Fuchida
Hiroshi Fujii
Application Number:
JP2001396563A
Publication Date:
July 25, 2007
Filing Date:
December 27, 2001
Export Citation:
Assignee:
Kyodo Printing Co., Ltd.
International Classes:
C08L101/00; F26B5/16; B29C47/00; C08J3/20; C08J5/00; C08K7/24; B29K101/12; B29K105/16; (IPC1-7): C08L101/00; B29C47/00; C08J3/20; C08J5/00; C08K7/24; F26B5/16; //(C08L101/00; C08L23:08); B29K101:12; B29K105:16
Domestic Patent References:
| JP9258386A | ||||
| JP9032258A | ||||
| JP2153946A | ||||
| JP2178344A | ||||
| JP4213344A | ||||
| JP2001342737A | ||||
| JP2002206046A | ||||
| JP2002226715A | ||||
| JP2003530452A |
Attorney, Agent or Firm:
Koichi Fujii
Kojiro Yoda
Kojiro Yoda