To obtain a resin composition of which cured material is excellent in a specific low water-absorption property, toughness or a low heat expansion property, and useful for an insulating material and a build-up printed circuit board by incorporating a specific epoxy resin, epoxy resin curing agent and a polyether sulfon.
This resin composition contains (A) preferably an epoxy resin of the formula [Gly is glycidyl; R is a 1-10C alkyl or the like; (i) is 0-4; (n) is 1-10] and having ≥2 glycidyl groups, (B) a polyhydric phenol-based epoxy resin curing agent (e.g.; a phenol novolak) and (C) preferably a polyether sulfon having a phenolic hydroxyl group at the terminal of its molecule. It is preferable that the using amount of the component A is 1-80 wt.% and that of the component C is 10-70 wt.%. The ratio of the epoxy equivalent of the component A to the hydroxyl group equivalent of the component B is preferably (1:0.8)-(1:1.2). In this composition, further 10-80 wt.% inorganic filler (e.g.; a silica) is preferably incorporated.
NAKAJIMA NOBUYUKI
SAITO NORIAKI
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