Title:
RESIN COMPOSITION AND BUILDUP WIRING BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2001164093
Kind Code:
A
Abstract:
To obtain an insulating resin composition capable of providing high adhesion between the insulating resin and a copper wiring in a buildup wiring board and to provide both the buildup wiring board having high adhesion and a method for producing the buildup wiring board.
This resin composition comprises an epoxy resin, an epoxy curing agent and a triazinedithiol compound having an unsaturated ethylene group.
Inventors:
ISHIZUKA TAKESHI
Application Number:
JP34668699A
Publication Date:
June 19, 2001
Filing Date:
December 06, 1999
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H05K3/46; C08F283/10; C08G59/00; C08K5/00; C08K5/37; C08L63/00; C09D4/00; C09D5/25; (IPC1-7): C08L63/00; C08F283/10; C08G59/00; C09D4/00; C09D5/25; H05K3/46
Domestic Patent References:
| JPH02269788A | 1990-11-05 | |||
| JPS53118499A | 1978-10-16 | |||
| JPH0722718A | 1995-01-24 | |||
| JPH01206686A | 1989-08-18 | |||
| JPS6453492A | 1989-03-01 | |||
| JP2000244131A | 2000-09-08 | |||
| JPH026573A | 1990-01-10 |
Attorney, Agent or Firm:
Takashi Ishida (4 others)