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Title:
RESIN COMPOSITION, COATING MATERIAL CONTAINING THE SAME, COATING FILM, AND PROCESS FOR FORMING COATING FILM
Document Type and Number:
Japanese Patent JP2009114314
Kind Code:
A
Abstract:

To provide a resin composition that forms coating films exhibiting excellent adhesion to various moldings etc. and that is excellent in storage stability at low temperature.

The resin composition is provided by mixing a photopolymerization initiator (d) in a resin solution (a) containing a modified product of a propylene-1-butene copolymer (A) in organic solvent. The propylene-1-butene copolymer (A) includes 50-95 mol% of propylene units and 5-50 mol% of 1-butene units and has a molecular weight distribution in the range of 1-3 as measured by GPC and a limiting viscosity of 0.1-12 dl/g. The modified product of the propylene-1-butene copolymer (A) is obtained by polymerizing a particular copolymerizable monomer (C) in the presence of a propylene-1-butene copolymer (A) in organic solvent at a weight ratio of (A)/(C)=1/9 to 9/1 to provide a resin mixture, followed by further carrying out polymerization reaction by generating radical.


Inventors:
ASAMI KEIICHI
Application Number:
JP2007288694A
Publication Date:
May 28, 2009
Filing Date:
November 06, 2007
Export Citation:
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Assignee:
MITSUI CHEMICALS INC
International Classes:
C08L51/06; C08F255/08; C09D7/12; C09D123/26; C09D151/06; C09D163/00
Domestic Patent References:
JP2002173514A2002-06-21
JPH08319324A1996-12-03
Foreign References:
WO2002057357A12002-07-25
Attorney, Agent or Firm:
Shunichiro Suzuki
Koji Makimura