樹脂組成物、導電性樹脂組成物、接着剤、導電性接着剤、電極形成用ペースト、半導体装置

Title:

樹脂組成物、導電性樹脂組成物、接着剤、導電性接着剤、電極形成用ペースト、半導体装置

Document Type and Number:

Japanese Patent JP6744859

Kind Code:

B2

Abstract:

There is provided a resin composition having long-term heat resistance and a low change ratio of adhesive strength. The resin composition includes (A) a compound having in its molecule an OH group and any one of primary to tertiary amines, (B) dicyandiamide, and (C) bismaleimides.

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Inventors:

Takashi Yamaguchi
Shinichi Abe

Application Number:

JP2017509957A

Publication Date:

August 19, 2020

Filing Date:

March 28, 2016

Export Citation:

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Assignee:

Namics Co., Ltd.

International Classes:

C08L61/34; C08G14/073; C08K3/00; C08L63/00; C08L79/00; C09J9/02; C09J179/04

Domestic Patent References:

JP2010260971A
JP2014523953A
JP2015025121A
JP2014227542A
JP2012097207A
JP2000017146A
JP2015032639A
JP2015052035A
JP2014194013A
JP2015054942A
JP2010248473A
JP2010248355A

Foreign References:

WO2015024256A1

Attorney, Agent or Firm:

Isshiki International Patent Service Corporation

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