Title:
RESIN COMPOSITION FOR CONNECTOR
Document Type and Number:
Japanese Patent JP3295982
Kind Code:
B2
Abstract:
PURPOSE: To provide a composition excellent in mechanical characteristics, heat resistance and flex resistance, having a lower specific gravity than those of conventional compositions, and suitable for electronic parts, etc., by adding a specific vinylic polymer and a specified glycidyl group-containing copolymer to a thermoplastic polyester.
CONSTITUTION: The composition comprises (A) 100 pts.wt. of a thermoplastic polyester (preferably polybutylene terephthalate, polyethylene terephthalate), (B) 5-100 pts.wt. of a vinylic copolymer produced by copolymerizing a monomer mixture containing (i) an aromatic vinyl monomer (preferably styrene or α- methylstyrene) and (ii) a vinyl cyanide monomer (preferably acrylonitrile), and (C) 1-50 pts.wt. of a glycidyl group-containing copolymer comprising (iii) α-olefin (preferably ethylene) and (iv) an α,β-unsaturated glycidyl ester (preferably diglycidyl methacrylate), and has a molded product specific gravity of 1.15-1.25.
Inventors:
Kiyomi Okuda
Jiro Kumaki
Kiyoshi Kuwata
Jiro Kumaki
Kiyoshi Kuwata
Application Number:
JP28196492A
Publication Date:
June 24, 2002
Filing Date:
October 20, 1992
Export Citation:
Assignee:
Toray Industries, Inc.
International Classes:
C08K5/15; C08K5/1515; C08L25/12; C08L67/00; C08L67/02; H01R13/46; (IPC1-7): C08L67/02; C08K5/1515
Domestic Patent References:
| JP57100154A | ||||
| JP2140262A | ||||
| JP63284216A |