Title:
RESIN COMPOSITION, CURED PRODUCT USING THE SAME, FLEXIBLE COPPER-CLAD LAMINATED BOARD, FLEXIBLE PRINTED BOARD, AND METHOD FOR PRODUCING THE FLEXIBLE PRINTED BOARD
Document Type and Number:
Japanese Patent JP2010195983
Kind Code:
A
Abstract:
To provide a thermosetting resin composition suitable to the applications of flexible printed boards and having a combination of heat resistance with flexural resistance, to provide a cured product using the same, to provide a flexible copper-clad laminated board, and to provide a method for producing the flexible printed board.
The resin composition includes: a compound (X) having an ethynyl group having general formula (1) as a constitutive unit and a polyimide (wherein, except the compound (X)); and at least one polymer (P) selected from the group consisting of polyether-imide, polyamide, polyamic acid, liquid-crystalline polyester, polyester, syndiotactic polystyrene, aromatic polysulfone, 5-methylpentene resin and cyclic polyolefin.
Inventors:
NAKAI YOSHIHIRO
AMAMIYA TAKUMA
IMAKUNI AKIRA
AMAMIYA TAKUMA
IMAKUNI AKIRA
Application Number:
JP2009044495A
Publication Date:
September 09, 2010
Filing Date:
February 26, 2009
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
C08L101/00; B32B15/08; C08K5/3417; C08L67/00; C08L79/08; C09D7/12; C09D123/20; C09D125/06; C09D145/00; C09D167/00; C09D177/00; C09D179/08; C09D181/06; H05K1/03; H05K3/28
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda
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