PURPOSE: To provide a resin composition for external semiconductive layer which can be peeled easily.

CONSTITUTION: The resin composition consists of (a) 100 pts. by wt. of ethylene-(25-45wt.%) vinyl acetate copolymer, (b) 30-70 pts. by wt. of kneaded mixture of ethylene-based resin and organopolysiloxane wherein the kneaded mixture is prepared by kneading and heating 100 pts. by wt. of the ethylene- based resin, 70-130 pts. by wt. of organopolysiloxane, and 0-1 pts. by wt. of an organic peroxide and the mixture contains gel in 10% or more, (c) 70-100 pts. by wt. of acetylene black, and (d) 1.0-2.2 pts. by wt. of an organic peroxide. The composition is applied to a polyolefine insulating layer on an electric power cable to form an external semiconductive layer and the layer can be peeled easily.