Title:
RESIN COMPOSITION FOR ELECTROLESS PLATING AND ELECTROLESS PLATING METHOD
Document Type and Number:
Japanese Patent JP3253900
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin compsn. for efficient electroless plating capable of forming electroless plating films having the solder heat resistance required for printed circuit boards and omitting an etching treatment stage and an electroless plating method using the resin compsn.
SOLUTION: This resin compsn. for electroless plating has (A) a chemical structure having at least one kind of the nitrogen-hydrogen bonds selected from a group consisting of an amino group, imino group, amide bond, urethane bond, urea bond, secondary amine and melamine structure and (B) halofunctional group in combination. The electroless plating method comprises executing the electroless plating contg. catalyst imparting and activating stages by applying the resin compsn. on the surfaces to be plated of nonconductors having adhesiveness and forming the films.
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Inventors:
Kenyuki Takagi
Kazuya Sato
Kazuya Sato
Application Number:
JP25600397A
Publication Date:
February 04, 2002
Filing Date:
September 04, 1997
Export Citation:
Assignee:
Sankei Giken Co., Ltd.
Okuno Pharmaceutical Co., Ltd.
Mitsui Chemicals, Inc.
Okuno Pharmaceutical Co., Ltd.
Mitsui Chemicals, Inc.
International Classes:
C23C18/16; H05K3/18; H05K3/38; (IPC1-7): C23C18/16
Attorney, Agent or Firm:
Naoto Kan (2 outside)