Title:
RESIN COMPOSITION AND ELECTRONIC PART CONSISTING OF THE SAME COMPOSITION
Document Type and Number:
Japanese Patent JPH05230367
Kind Code:
A
Abstract:
PURPOSE:To obtain a resin composition having heat resistance capable of carrying out soldering by a surface mounting type system. CONSTITUTION:The objective resin composition is obtained by blending nylon 46 resin with an amorphous polyamide having >=120 deg.C glass transition point, a halogenated compound represented by a brominated polystyrene, an antimony oxide based flame retardant auxiliary agent, a glass fiber and a crystal nucleating aid such as talc. A molded product obtained from the resin composition has low absorption and is improved also in dimensional stability.
Inventors:
HIRONAKA KATSUHIKO
NISHIJIMA KIYOAKI
NISHIJIMA KIYOAKI
Application Number:
JP8203192A
Publication Date:
September 07, 1993
Filing Date:
April 03, 1992
Export Citation:
Assignee:
TEIJIN LTD
International Classes:
C08K3/22; C08K3/34; C08K7/14; C08L25/18; C08L73/00; C08L77/00; C08L77/06; H01C1/02; H01R13/46; (IPC1-7): C08K3/22; C08K3/34; C08K7/14; C08L25/18; C08L77/06; H01C1/02; H01R13/46
Attorney, Agent or Firm:
Maeda Junhiro