Title:
RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT-MOUNTED FACE OF CIRCUIT BOARD MOUNTED WITH SEMICONDUCTOR ELEMENT, OR SEMICONDUCTOR ELEMENT-FORMED FACE OF WAFER FORMED WITH SEMICONDUCTOR ELEMENT, AND USE OF THE SAME
Document Type and Number:
Japanese Patent JP2023179928
Kind Code:
A
Abstract:
To provide an encapsulation resin composition favorable for application of encapsulating a semiconductor element-mounted face of a circuit board mounted with a semiconductor element, or a semiconductor element-formed face of a wafer formed with a semiconductor element, and excellent in low warpage property and grindability.SOLUTION: A resin composition for encapsulating a semiconductor element-mounted face of a circuit board mounted with a semiconductor element, or a semiconductor element-formed face of a wafer formed with a semiconductor element includes: (A) a maleimide compound having one or more hydrocarbon group(s) derived from a dimer acid skeleton in one molecule; (B) a reaction initiator; and (C) an inorganic filler subjected to surface treatment with a silane coupling agent, where the maximum particle size of the constituent (C) is 40 μm or less.SELECTED DRAWING: None
Inventors:
HORIGOME HIROKI
OSADA MASAKAZU
KAWAMURA NORIFUMI
YOKOTA RYUHEI
HAGIWARA KENJI
OSADA MASAKAZU
KAWAMURA NORIFUMI
YOKOTA RYUHEI
HAGIWARA KENJI
Application Number:
JP2022092872A
Publication Date:
December 20, 2023
Filing Date:
June 08, 2022
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08F22/40
Attorney, Agent or Firm:
Patent Attorney Corporation Ushiki International Patent Office