Title:
RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR, AND METHOD FOR ENCAPSULATING SEMICONDUCTOR USING THE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2016108367
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition for encapsulating a semiconductor low in a viscosity and having fluidity at room temperature, high in a glass transition point, and capable of suppressing a warpage of a resin-encapsulating molded article, and a method for encapsulating a semiconductor reduced in a warpage even after resin-encapsulating molding, specifically a method for encapsulating a wafer level package.SOLUTION: The resin composition for encapsulating a semiconductor includes: 3, 4, 3', 4'-diepoxy bicyclohexyl (A) which is an alicyclic epoxy compound constituted by singly bonding two cyclohexene oxide groups; an epoxy resin (B) which is liquid at room temperature except for the alicyclic epoxy compound (A) denoted above; an acid anhydride hardener (C); a hardening accelerator (D); and an inorganic filler (E) where the amount of composition of (A) constituent in 100 pts.mass of a total epoxy resin in the composition is 30-95 pts.mass.SELECTED DRAWING: None
Inventors:
KUSHIHARA NAOYUKI
SUMIDA KAZUMASA
SUMIDA KAZUMASA
Application Number:
JP2014244154A
Publication Date:
June 20, 2016
Filing Date:
December 02, 2014
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08G59/24; H01L23/29; H01L23/31
Domestic Patent References:
| JP2012209453A | 2012-10-25 | |||
| JP2011168650A | 2011-09-01 |
Attorney, Agent or Firm:
Mamoru Ushiki
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