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Patent Searching and Data


Title:
RESIN COMPOSITION AND FILM OBTAINED BY MOLDING THE SAME
Document Type and Number:
Japanese Patent JP2012001589
Kind Code:
A
Abstract:

To provide a resin composition excellent in all of heat resistance, transparency, impact resistance and drawability.

The resin composition is fabricated which contains as a main component a mixture (X) comprising a polytrimethylene terephthalate (A), and a polyesteric resin (B), wherein the polyesteric resin (B) has a glass transition temperature of ≥90°C and ≤140°C, and exhibits no crystal melting peak when being heated from -40°C to 250°C at a temperature-rise rate of 10°C/min in a differential scanning calorimetry; and the mixture (X) has a single glass transition temperature, which is higher than that of the polytrimethylene terephthalate (A) and lower than that of the polyesteric resin (B).


Inventors:
TANAKA KAZUYA
Application Number:
JP2010135957A
Publication Date:
January 05, 2012
Filing Date:
June 15, 2010
Export Citation:
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Assignee:
MITSUBISHI PLASTICS INC
International Classes:
C08L67/02
Domestic Patent References:
JP2003012904A2003-01-15
JP2002512289A2002-04-23
JP2007254720A2007-10-04
JP2007196678A2007-08-09
JP2003012904A2003-01-15
JP2002512289A2002-04-23
JP2007254720A2007-10-04