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Patent Searching and Data


Title:
RESIN COMPOSITION AND FILM
Document Type and Number:
Japanese Patent JP2023070869
Kind Code:
A
Abstract:
To provide a transparent film having high transparency and sufficient mechanical strength, and a resin composition used for manufacturing the film.SOLUTION: Provided is a resin composition containing polyimide and ester-based resin, where the polyimide has a structure derived from tetracarboxylic acid dianhydride and a diamine-derived structure, has fluoroalkyl substituted benzidine and alicyclic diamine as the diamine-derived structure, and has fluorine-containing aromatic tetracarboxylic acid dianhydride as the structure derived from tetracarboxylic acid dianhydride, and the ester-based resin has any structure selected from the group of (meth)acrylic acid ester (co)polymer, fumaric acid diester (co)polymer and maleic acid diester (co)polymer.SELECTED DRAWING: None

Inventors:
OGAWA KOHEI
ISHIGURO FUMIYASU
KORAI HIROTO
USHIRO HIROYUKI
Application Number:
JP2021183263A
Publication Date:
May 22, 2023
Filing Date:
November 10, 2021
Export Citation:
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Assignee:
KANEKA CORP
International Classes:
C08L79/08; C08G73/10; C08J5/18; C08L33/12; C08L35/00