Title:
フレキシブルデバイス用樹脂組成物、フレキシブルデバイス用フィルム状接着剤、フレキシブルデバイス用接着シート、及びフレキシブルデバイスの製造方法
Document Type and Number:
Japanese Patent JP7450116
Kind Code:
B2
Abstract:
A resin composition for a flexible device, containing an epoxy resin and a phenoxy resin, wherein a cured product of the resin composition has a glass transition temperature of 60° C. or higher, and the cured product has a storage modulus of 5.0 GPa or less,a film-like adhesive using the resin composition,an adhesive sheet having a laminated structure of the film-like adhesive anda flexible base material, and a method of producing a flexible device.
Inventors:
Koyuki Sakai
Application Number:
JP2023515591A
Publication Date:
March 14, 2024
Filing Date:
December 12, 2022
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
C08G59/62; B32B7/022; B32B7/027; B32B27/00; B32B27/38; C08G59/26; C08K5/54; C08L63/00; C08L63/02; C08L71/10; C09J7/30; C09J11/06; C09J163/02; C09J171/00; H01L21/52
Domestic Patent References:
| JP2012241147A | ||||
| JP2012097195A | ||||
| JP2021123029A |
Foreign References:
| WO2020251030A1 | ||||
| WO2021200757A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Iida and Partners
Toshizo Iida
Shuichi Akabane
Yukie Tanaka
Toshizo Iida
Shuichi Akabane
Yukie Tanaka