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Title:
RESIN COMPOSITION FOR GAS AND/OR LIQUID BARRIER AND MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2001172496
Kind Code:
A
Abstract:

To obtain a resin composition for a gas and/or a liquid barrier and a molded product thereof capable of improving a surface appearance, processing stability, damping properties and dimensional stability in a use under a high humidity in addition to permeation resistance of the gas and/or the liquid.

This resin composition for the gas and/or the liquid barrier is characterized in that the resin composition comprises (A) 50-99.9 wt.% of a polyketone copolymer composed of recurring units represented by general formulae (1) and (2) and (B) 50-0.1 wt.% of a liquid crystalline resin and the (B) is dispersed into a matrix of the (A). Moreover, ≥60% of the dispersed particle of the (B) has 0.5 α-1.5 α dispersed diameter [α is weight-average dispersed particle diameter of the dispersed particle of the (B)].


Inventors:
UMETSU HIDEYUKI
TACHIKAWA KOJI
SATO DAISUKE
Application Number:
JP36189299A
Publication Date:
June 26, 2001
Filing Date:
December 20, 1999
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
C08J5/00; C08J5/18; C08L67/04; C08L73/00; (IPC1-7): C08L73/00; C08L67/04