Title:
ヒートシール用樹脂組成物及びそれを用いたフィルム
Document Type and Number:
Japanese Patent JP7294766
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition for heat seal which forms weak seal width in 2.9-9.8 N/15 mm in a wide temperature range, and can also form strong seal width in 29.4 N/15 mm at a practical heat seal temperature of 160°C or lower.SOLUTION: A resin composition contains a polypropylene resin (A) having a specific melt flow rate (MFR) and a melting point peak temperature and a polypropylene resin (B) having a specific MFR and a melting point peak temperature in a specific ratio, where a difference in the melting point peak temperature between the polypropylene resin (A) and the polypropylene resin (B) is 20°C or higher, and the MFR of the polypropylene resin (A) and the MFR of the polypropylene resin (B) satisfy relational expression (I):2≤MFR(A)/MFR(B)≤100.SELECTED DRAWING: None
Inventors:
Daisuke Uchida
Tomoki Uchida
Tomoki Uchida
Application Number:
JP2017096294A
Publication Date:
June 20, 2023
Filing Date:
May 15, 2017
Export Citation:
Assignee:
Japan Polypropylene Corporation
International Classes:
C08L23/10; A61J1/10; C08L21/00
Domestic Patent References:
| JP2013112736A | ||||
| JP2012082405A |
Attorney, Agent or Firm:
Makoto Ono
Kennori Kanayama
Yoshiyuki Tsubokura
Kazuki Shigemori
Yoshikazu Iwase
Yasufumi Shiroyama
Kennori Kanayama
Yoshiyuki Tsubokura
Kazuki Shigemori
Yoshikazu Iwase
Yasufumi Shiroyama
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