Title:
高周波基板用樹脂組成物及び金属積層板
Document Type and Number:
Japanese Patent JP7209764
Kind Code:
B2
Abstract:
A resin composition for a high frequency substrate and a metal clad laminate are provided. Based on a total weight of the resin composition for the high frequency substrate being 100 phr, the resin composition for the high frequency substrate includes: 20 phr to 70 phr of a polyphenylene ether resin, 5 phr to 40 phr of a polybutadiene resin, 5 phr to 30 phr of a bismaleimide resin, and 20 phr to 45 phr of a crosslinker. A glass transition temperature of the resin composition for the high frequency substrate is higher than or equal to 230° C. The metal clad laminate includes a substrate and a metal layer disposed on the substrate. The substrate is formed from the resin composition for the high frequency substrate.
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Inventors:
廖 ▲徳▼超
Chen Tzu-Hao
Hiroki Zhang
Liu family
Zhi Chi Zhang
Chen Tzu-Hao
Hiroki Zhang
Liu family
Zhi Chi Zhang
Application Number:
JP2021076148A
Publication Date:
January 20, 2023
Filing Date:
April 28, 2021
Export Citation:
Assignee:
NAN YA PLASTICS CORPORATION
International Classes:
H05K1/03; B32B15/08; C08K5/3415; C08L9/00; C08L81/02
Foreign References:
| WO2019230945A1 | ||||
| WO2020096036A1 |
Attorney, Agent or Firm:
Murayama Yasuhiko
Shinya Mihiro
Tatsuhiko Abe
Shinya Mihiro
Tatsuhiko Abe
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