Title:
RESIN COMPOSITION AND HOT-MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2023144932
Kind Code:
A
Abstract:
To provide a resin composition which is excellent in water vapor barrier property while maintaining flowability and adhesion of a resin excellent in low pressure molding.SOLUTION: A resin composition contains a copolymer polyester resin (A), a polyolefin resin (B), a tackifier (C), an epoxy resin (D) and a filler (E), wherein the copolymer polyester resin (A) has a polycarboxylic acid component and a polyol component as structural units, and when the total polyol components are 100 mol%, the copolymer amount of a polyalkylene glycol component is 1 mol% or more and 25 mol% or less.SELECTED DRAWING: None
Inventors:
MURAKAMI YUKI
IWASHITA YUJI
IWASHITA YUJI
Application Number:
JP2022052154A
Publication Date:
October 11, 2023
Filing Date:
March 28, 2022
Export Citation:
Assignee:
TOYOBO MC CO LTD
International Classes:
C08L67/00; C08K3/013; C08L23/08; C08L61/14; C08L63/00; C09J11/04; C09J11/08; C09J167/00
Previous Patent: Service provision equipment, service provision method, and program
Next Patent: Polypropylene heat shrinkable film
Next Patent: Polypropylene heat shrinkable film