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Title:
RESIN COMPOSITION FOR INFLATION MOLDING, AND MOLDED FILM OF THE SAME
Document Type and Number:
Japanese Patent JP2008088248
Kind Code:
A
Abstract:

To provide a resin composition without causing powdering on its inflation molding and a molded film of the same.

This resin composition for the inflation molding is characterized by blending 99.95 to 90 pts.mass high density polyethylene having 0.938 g/cm3 density with 0.05 to 10 pts.mass ultra high molecular weight polyethylene. The ultra high molecular weight polyethylene is preferably the ultra high molecular weight polyethylene powder having 5 to 40 m mean particle diameter. Since the ultra high molecular weight polyethylene has 1,000,000 to 6,000,000 mass-average molecular weight, it does not melt in a usual inflation molding temperature region, and exhibits an effect of an anti-blocking agent. By using the ultra high molecular weight polyethylene powder excellent in abrasion resistance as an anti-blocking agent and co-extruding it by blending with the high density polyethylene, since the film surface becomes a rough surface to make a contact surface area with a stabilizing plate, etc., smaller, powdering does not occur.


Inventors:
NAKAMURA HITOSHI
HOSOI HIROSHI
SUGA KATSUFUMI
NAKAMURA TARO
Application Number:
JP2006269317A
Publication Date:
April 17, 2008
Filing Date:
September 29, 2006
Export Citation:
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Assignee:
TAMAPORI KK
International Classes:
C08L23/04; B29C55/28; B32B27/32
Attorney, Agent or Firm:
Wintech Patent Business Corporation