To provide a resin compsn. for forming an insulation layer excellent in adhesiveness with an electroless plating film in a multi-layer wiring board and has also heat resistance.
This resin compsn. for insulation layer is obtd. by mixing and kneading an ultraviolet curing resin (A) obtd. by reacting a reaction product of a bisphenol type epoxy compd. and an unsaturated monocarboxylic acid, and an anhydride of a saturated or unsaturated polybasic acid, a multifunctional epoxy compd.(B), an epoxy compd. having not less than 2 alicyclic epoxy groups (C), an epoxy compd. having a (meth) acrylic group and an epoxy group in a molecule (D), a photo radical polymerization initiator (E), a photo-cation polymerization initiator (F), a filler (G), and a diluent (H).
KAWAMOTO KENJI
CHINO MASAAKI
WATANABE TAKUZO
