Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
多層プリント配線板の層間絶縁用樹脂組成物、接着フィルム及びプリプレグ
Document Type and Number:
Japanese Patent JP4725704
Kind Code:
B2
More Like This:
WO/1991/009917PROCESS FOR COATING ELECTRICALLY CONDUCTIVE SUBSTRATES, AQUEOUS ENAMEL, EPOXIDE AMINE ADDUCT AND USE OF THE EPOXIDE AMINE ADDUCT AS A FRICTION RESIN FOR PREPARING PIGMENT PASTES
WO/2023/285221EPOXIDE-ACRYLATE HYBRID MOLECULES AND THEIR USE FOR CHEMICAL ANCHORING
JP7168157COMPOSITION FOR HIGHLY HEAT RESISTANT RESIN CURED MATERIAL, ELECTRONIC COMPONENTS AND SEMICONDUCTOR DEVICE USING THE SAME
Inventors:
Shigeo Nakamura
Kenji Kawai
Application Number:
JP2004158247A
Publication Date:
July 13, 2011
Filing Date:
May 27, 2004
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08G59/38; C08J5/24; C08L63/00; C09J7/00; C09J11/04; C09J11/06; C09J129/14; C09J163/00; C09J171/10; C09J177/00; C09J179/08; H01B3/00; H05K3/46
Domestic Patent References:
JP9059346A
JP2002241590A
JP2001181375A
Foreign References:
WO2000009623A1



 
Previous Patent: コンバイン

Next Patent: 微小構造体の製造方法