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Patent Searching and Data


Title:
RESIN COMPOSITION AND ITS MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2003155419
Kind Code:
A
Abstract:

To obtain a resin composition which excels in transparency, heat sealability, gas barrier properties, recycling properties, and mold processing properties.

The resin composition comprises (A) 0.1-20 pts.wt. thermoplastic polymer having a functional group (f), (B) 1-70 pts.wt. crystalline resin containing a polymer chain having a component which reacts with the functional group (f) at the terminal, and (C) 10-98.9 pts.wt. olefin based resin, and the component (C) is a continuous phase; the enthalpy (ΔHc1) of crystallization of the crystalline resin component of the component (B) having a crystallization initiation temperature of >150°C and the enthalpy (ΔHm1) of fusion of the crystalline resin component of the component (B) meet the formulae: X=ΔHc1/ΔHm1 and 0≤X≤0.7; and the melting point of the crystalline resin component of the component (B) is >150°C.


Inventors:
YONEZAWA JUN
SASAYA EIJI
Application Number:
JP2001354936A
Publication Date:
May 30, 2003
Filing Date:
November 20, 2001
Export Citation:
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Assignee:
ASAHI KASEI CORP
International Classes:
B65D1/00; B65D1/09; B65D65/02; C08G81/00; C08J5/18; C08L23/00; C08L77/02; C08L101/02; (IPC1-7): C08L101/02; B65D1/09; B65D65/02; C08G81/00; C08J5/18; C08L23/00; C08L77/02