Title:
樹脂組成物及びその用途
Document Type and Number:
Japanese Patent JP6921867
Kind Code:
B2
Abstract:
A resin composition comprises: a modified EVOH (A) that is represented by a following formula (I), has contents (mol%) of a, b, and c based on the total monomer units satisfying following formulae (1) through (3), and has a degree of saponification (DS) defined by a following formula (4) of 90 mol% or more; and inorganic oxide particles (B), wherein a content of the inorganic oxide particles (B) is from 5 to 5000 ppm. Such a resin composition is improved in adhesion to a resin other than EVOH, secondary processability, and flexibility without decreasing the performances originally possessed by EVOH, such as gas barrier properties, transparency, flavor retention, solvent resistance, and oil resistance. Accordingly, the resin is preferably used as a molded article, a film, a sheet, a heat shrinkable film, a thermoformed article, a multilayer structure, a coinjection stretch blow molded container, a fuel container, and the like.18≤a≤550.01≤c≤20100−a+c×0.9≤b≤100−a+cDS=TotalNumberofMolesofHydrogenAtomsinX,Y,andZ/TotalNumberofMolesofX,Y,andZ×100
Inventors:
Masato Okamoto
Hirotaka Shioda
Makoto Suzuki
Hirotaka Shioda
Makoto Suzuki
Application Number:
JP2018559644A
Publication Date:
August 18, 2021
Filing Date:
December 28, 2017
Export Citation:
Assignee:
KURARAY CO.,LTD.
International Classes:
C08L29/04; B32B27/28; C08F8/12; C08J5/18; C08K3/20; C08K3/22; C08K3/36
Domestic Patent References:
JP2016029156A | ||||
JP2014034647A | ||||
JP2015151428A | ||||
JP2000265025A | ||||
JP2000351883A | ||||
JP2009097010A |
Foreign References:
WO2015115511A1 | ||||
WO2011118762A1 |
Attorney, Agent or Firm:
Setouchi International Patent Firm