RESIN COMPOSITION FOR LAMINATE AND COPPER-CLAD LAMINATE MADE BY USING SAME

Title:

RESIN COMPOSITION FOR LAMINATE AND COPPER-CLAD LAMINATE MADE BY USING SAME

Document Type and Number:

Japanese Patent JPH08231654

Kind Code:

A

Abstract:

PURPOSE: To obtain a resin composition which can give a laminate reduced in warpage during processing, being excellent in performances such as heat resistance and nonabrasiveness to drill and being capable of cost down.

CONSTITUTION: A normally liquid resin composition for a laminate, which contains a radical-polymerizable resin, a radical-polymerizable monomer, a crosslinked acrylic resin powder and talc and in which the crosslinked acrylic resin powder and the talc are dispersed. More particularly, a resin composition containing 100 pts.wt., in total, radical-polymerizable resin and a radical- polymerizable monomer and 3-15 pts.wt. crosslinked acrylic resin powder and/or 5-100 pts.wt. talc.

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Inventors:

OGASAWARA KENJI
KODERA KOHEI
TSUJIMOTO MASAYA
MARUMOTO YOSHINOBU
SHINOYA KENICHI
KASHIWABARA KEIKO

Application Number:

JP3827695A

Publication Date:

September 10, 1996

Filing Date:

February 27, 1995

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC WORKS LTD

International Classes:

B32B15/08; C08F290/00; C08F290/06; C08K3/34; C08L33/00; C08L33/04; C08L67/06; C09J4/00; H05K1/03; (IPC1-7): C08F290/06; B32B15/08; C08L67/06; C09J4/00; H05K1/03

Attorney, Agent or Firm:

Shigeji Sato (1 person outside)

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