PURPOSE: To obtain a resin compsn. for the production of multilayer circuit boards by compounding a specific epoxy resin, a specific carboxylated rubber, a curative for an epoxy resin. and a cure accelerator.

CONSTITUTION: This compsn. comprises 30-100 pts.wt. epoxy resin having a number average mol.wt. (Mn) of 1,200 or higher, 30-70 pts.wt. carboxylated acrylic or acrylonitrile-butadiene rubber, a curative for an epoxy resin, and a cure accelerator. The curative is pref. a novolak phenol resin or a novolak cresol resin in an amt. of 30-100 pts.wt. The compsn. further contg. 0.5-20 pts.wt. ion scavenger (e.g. silica gel) is still pref.