Title:
RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME, AND PREPREG FOR PRINTED WIRING BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2003147051
Kind Code:
A
Abstract:
To provide a resin composition having excellent adhesive strength to a metal foil, especially a copper foil, and further having excellent heat resistance, moisture resistance and electrolytic corrosion resistance, and further to provide a method for producing the resin composition and a prepreg for a printed wiring board using the composition.
This resin composition consists essentially of (A) a condensate of a primary and/or secondary amine compound with an epoxy resin, (B) the epoxy resin and (C) a phenol resin.
Inventors:
SAITO TETSUYA
BABA AKIO
MADARAME TAKESHI
MIZUNO YASUYUKI
BABA AKIO
MADARAME TAKESHI
MIZUNO YASUYUKI
Application Number:
JP2001344839A
Publication Date:
May 21, 2003
Filing Date:
November 09, 2001
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08J5/24; C08G59/50; C08G59/62; H05K1/03; (IPC1-7): C08G59/62; C08G59/50; C08J5/24; H05K1/03