Title:
金型離型回復用樹脂組成物及び金型離型回復方法
Document Type and Number:
Japanese Patent JP5242555
Kind Code:
B2
Abstract:
Disclosed is a resin composition for recovering mold releasability, which provides the surface of a mold with releasability after removing dirt on the mold surface during molding of a curable resin molding material. This resin composition contains a melamine resin, while further containing at least one metallic soap-based mold release agent and an organic fatty acid ester-based mold release agent or/and a synthetic wax. This resin composition for recovering mold releasability enables to recover excellent mold releasability which lasts for a long time, and thus enables to continuously mold a sealing article for a long time.
Inventors:
Kiyoto Hiromitsu
Hiroaki Nomura
Ken Hamaura
Hiroaki Nomura
Ken Hamaura
Application Number:
JP2009507467A
Publication Date:
July 24, 2013
Filing Date:
March 24, 2008
Export Citation:
Assignee:
Nippon Carbide Industry Co., Ltd.
International Classes:
B29C33/60
Domestic Patent References:
| JPS62132964A | 1987-06-16 | |||
| JP2000143995A | 2000-05-26 | |||
| JP2001247755A | 2001-09-11 | |||
| JPS4879849A | 1973-10-26 | |||
| JPH07309998A | 1995-11-28 | |||
| JPH09290424A | 1997-11-11 | |||
| JPH0957762A | 1997-03-04 | |||
| JPH0381111A | 1991-04-05 |
Attorney, Agent or Firm:
Osamu Hatori