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Patent Searching and Data


Title:
RESIN COMPOSITION AND RESIN MOLDED BODY
Document Type and Number:
Japanese Patent JP2002088248
Kind Code:
A
Abstract:

To provide a composition of an alicyclic structure=containing polymer, which gives a molded body excellent in impact resistance and surface smoothness, heat-resistant and having comparatively good transparency.

The resin composition comprises (A) more than 20 wt.% but less than 98.5 wt.% of an alicyclic structure-containing polymer and (B) less than 80 wt.% but more than 1.5 wt.% of a copolymer of raw monomers containing an α-olefin and a vinyl aromatic compound.


Inventors:
TAZAKI SATOSHI
MATSUMOTO YUICHI
Application Number:
JP2000275903A
Publication Date:
March 27, 2002
Filing Date:
September 12, 2000
Export Citation:
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Assignee:
NIPPON ZEON CO
International Classes:
C08J5/00; C08L23/02; C08L25/02; C08L101/00; (IPC1-7): C08L101/00; C08J5/00; C08L23/02; C08L25/02
Attorney, Agent or Firm:
Hitoshi Maeda (2 outside)