Title:
RESIN COMPOSITION, MOLDED ARTICLE, KIT, AND METHOD FOR PRODUCING MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2023168132
Kind Code:
A
Abstract:
To provide a resin composition that can provide a molded article with high light transmittance, superior laser welding strength, and superior appearance (black taste), and a molded article, a kit, a method for producing a molded article, an on-vehicle camera component, and an on-vehicle camera.SOLUTION: A resin composition contains a polyamide resin and also contains a total of 0.1-5.0 pts.mass of a 1,2-phenylene benzimidazoperylene compound and a green pigment relative to 100 pts.mass of the polyamide resin. The mass ratio between the 1,2-phenylene benzimidazoperylene compound and the green pigment is 1: 0.1-5.0.SELECTED DRAWING: None
Inventors:
OKAMOTO AKITO
TOKI HIROMASA
TOKI HIROMASA
Application Number:
JP2022079793A
Publication Date:
November 24, 2023
Filing Date:
May 13, 2022
Export Citation:
Assignee:
GLOBAL POLYACETAL CO LTD
International Classes:
C08L77/00; C08G69/26; C08K3/013; C08K3/16; C08K5/3417; C08K5/3447
Attorney, Agent or Firm:
Sykes Patent Attorney Corporation
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