Title:
RESIN COMPOSITION AND MOLDED PRODUCT THEREOF
Document Type and Number:
Japanese Patent JPH0249052
Kind Code:
A
Abstract:
PURPOSE:To obtain a resin composition, containing vinylidene chloride resin and a low-melting polyamide resin in a specific proportion and capable of producing films, sheets or containers excellent in gas barrier properties and low- temperature impact strength. CONSTITUTION:A resin composition consisting of (A) 60-95wt.%, preferably 65-90wt.% vinylidene chloride resin, preferably a copolymer of 65-98wt.% vinylidene chloride with 2-35wt.% copolymerizable monomer (e.g. vinyl chloride or acrylonitrile) and (B) 5-40wt.%, preferably 10-35wt.% low-melting polyamide resin (e.g., nylon 6-66 or nylon 6-69) having preferably <=210 deg.C, preferably <=200 deg.C, more preferably <=190 deg.C crystal melting point. A film, sheet or container obtained by melt molding the above-mentioned composition has specific values or below of oxygen permeation coefficient and moisture permeability and <=10 deg.C brittle temperature expressed in terms of a film Tb value.
Inventors:
KUSUMI NOBUYUKI
UEHARA TSUTOMU
OBA HIROYUKI
HIROSE KAZUHIKO
UEHARA TSUTOMU
OBA HIROYUKI
HIROSE KAZUHIKO
Application Number:
JP8545489A
Publication Date:
February 19, 1990
Filing Date:
April 04, 1989
Export Citation:
Assignee:
KUREHA CHEMICAL IND CO LTD
International Classes:
B29D7/01; B29D22/00; C08L27/08; C08L77/00; B29K55/00; (IPC1-7): B29D7/01; B29D22/00; B29K55/00; C08L27/08
Domestic Patent References:
| JPS578237A | 1982-01-16 | |||
| JPS5584344A | 1980-06-25 |
Attorney, Agent or Firm:
Yoshio Kawaguchi (2 outside)
Next Patent: JPH0249053