RESIN COMPOSITION FOR MOLDING MATERIAL, MOLDING MATERIAL, AND MOLDED ARTICLE

Title:

RESIN COMPOSITION FOR MOLDING MATERIAL, MOLDING MATERIAL, AND MOLDED ARTICLE

Document Type and Number:

Japanese Patent JP2023115529

Kind Code:

A

Abstract:

To provide: a resin composition for a molding material, which has low viscosity, is excellent in moldability, and can afford a molded product complying with a non-flammable standard in a material combustion test for railroad cars; the molding material; and the molded article.SOLUTION: Used is a resin composition for molding which is a resin composition for a molding material containing a vinyl ester resin (A), an unsaturated monomer (B), aluminum hydroxide (C) and a polymerization initiator (D), in which an epoxy equivalent of an epoxy resin being a raw material of the vinyl ester resin (A) is 185-400, a mass ratio (A/B) of the vinyl ester resin (A) to the unsaturated monomer (B) is 45/55-75/25, and the content of the aluminum hydroxide (C) is 200-500 pts.mass based on 100 pts.mass of the sum total weight of the vinyl ester resin (A) and the unsaturated monomer (B).SELECTED DRAWING: None

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Inventors:

YAMAMOTO SHUHEI
TOMOKUNI HIDEHIKO

Application Number:

JP2022017783A

Publication Date:

August 21, 2023

Filing Date:

February 08, 2022

Export Citation:

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Assignee:

DAINIPPON INK & CHEMICALS

International Classes:

C08L63/10; C08F2/44; C08F292/00; C08G59/17; C08J5/04; C08K3/22

Attorney, Agent or Firm:

Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno

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