Title:
RESIN COMPOSITION AND MOLDING USING THE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2021080428
Kind Code:
A
Abstract:
To provide a resin composition obtained by imparting impact resistance, flexibility and recyclability to a composite resin in which a fragile resin, a recycled resin or two or more different kinds of resins are mixed, and a molding using the resin composition.SOLUTION: The resin composition contains 1 wt.% or more and 99 wt.% or less of a thermoplastic resin (A) and 1 wt.% or more and 99 wt.% or less of an ethylene-vinyl acetate copolymer composition (B) containing two or more kinds of ethylene-vinyl acetate copolymers having different vinyl acetate contents. The total of (A) and (B) is 100 wt.%.SELECTED DRAWING: None
Inventors:
KUGIMOTO HIROSHI
KAWATO DAISUKE
KODA SHINGO
KAWATO DAISUKE
KODA SHINGO
Application Number:
JP2020005783A
Publication Date:
May 27, 2021
Filing Date:
January 17, 2020
Export Citation:
Assignee:
TOSOH CORP
International Classes:
C08L101/00; C08L23/08; C08L23/26; C08L29/04; C08L31/04
Domestic Patent References:
| JP2018145407A | 2018-09-20 | |||
| JP2002241548A | 2002-08-28 | |||
| JP2008038142A | 2008-02-21 | |||
| JP2003301077A | 2003-10-21 | |||
| JP2005023190A | 2005-01-27 | |||
| JPH07157734A | 1995-06-20 | |||
| JP2012024960A | 2012-02-09 |
Foreign References:
| WO2014010500A1 | 2014-01-16 |