To obtain a resin composition for molding having excellent filling properties and workability, slight wear in a molding and a processing processes, high thermal conductivity and slight internal stress.

This resin composition for molding comprises (A) 30-90 wt.% of an inorganic filler having ≤300 μm maximum particle diameter and ≥5 μm and ≤70 μm average particle diameter, (B) 5-50 wt.% of a titanium oxide filler having ≤5 μm maximum particle diameter and ≥0.05 μm and ≤1 μm average particle diameter and (C) 5-50 wt.% of a thermosetting resin as essential components.