Title:
RESIN COMPOSITION AND MOLDING
Document Type and Number:
Japanese Patent JP2013129749
Kind Code:
A
Abstract:
To provide a resin composition of polyacetal copolymer having practically satisfactory heat resistance, mechanical properties and moldability, further excellent in wet heat resistance; and a molding thereof.
This polyacetal resin composition includes, based on a polyacetal copolymer (A) in which the content of oxyalkylene unit per 100 moles of oxymethylene units is 0.4-17.0 moles: 0.01-1.0 pt.wt. of an amine-substituted triazine compound (B); 0.01-5.0 pts.wt. of a hindered phenol (C); 0.001-3.0 pts.wt. of a hindered amine (D); and 0.005-0.05 pt.wt. of one or more metal-containing compounds (E) selected from a group consisting of a hydroxide, inorganic acid salt or alkoxide of alkali metals or alkaline earth metals.
More Like This:
WO/2005/033183 | PROCESS FOR PRODUCING COPOLYACETAL |
WO/2009/127388 | OXYMETHYLENE POLYMERS, METHOD FOR THE PRODUCTION THEREOF, AND USE OF SAME |
JP3161061 | PRODUCTION OF OXYMETHYLENE COPOLYMER |
Inventors:
SHINNAI MIKIHIRO
ITO AKIRA
ITO AKIRA
Application Number:
JP2011279958A
Publication Date:
July 04, 2013
Filing Date:
December 21, 2011
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
C08L59/04; C08K3/18; C08K5/13; C08K5/17; C08K5/3492
Domestic Patent References:
JPH06256621A | 1994-09-13 | |||
JP2006111874A | 2006-04-27 | |||
JP2004026857A | 2004-01-29 |
Foreign References:
WO2002024807A1 | 2002-03-28 | |||
WO2011111823A1 | 2011-09-15 |
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