Title:
RESIN COMPOSITION AND MOLDING
Document Type and Number:
Japanese Patent JP3720449
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a resin composition and a molding having good moisture- absorbing and releasing properties, abrasion resistance, hardness and touch feeling.
SOLUTION: This resin composition contains an olefin-based thermoplastic elastomer or a styrene-based thermoplastic elastomer, a natural organic fine powder and a silicone. This molding is obtained by molding the resin into a sheet, etc. Silk, cellulose, collagen, etc., can be used as a raw material for natural organic fine powder.
More Like This:
Inventors:
Usuhara Atsuhiko
Application Number:
JP8932696A
Publication Date:
November 30, 2005
Filing Date:
April 11, 1996
Export Citation:
Assignee:
IDEMITSU KOSAN CO.,LTD.
International Classes:
C08L1/00; C08L5/00; C08L9/06; C08L21/00; C08L23/00; C08L23/16; C08L25/00; C08L83/04; C08L89/00; C08L101/00; (IPC1-7): C08L21/00; C08L1/00; C08L5/00; C08L9/06; C08L23/16; C08L83/04; C08L89/00
Domestic Patent References:
| JP8003326A | ||||
| JP5239256A |
Attorney, Agent or Firm:
Kinoshita Minoru
Kanji Nakayama
Tsuyoshi Ishizaki
Kanji Nakayama
Tsuyoshi Ishizaki
Previous Patent: POLARIZING PLATE
Next Patent: METHOD FOR APPLYING FULUORORESIN ONTO CYLINDER OR COLUMN AND ELASTIC BODY, AND FIXING COMPONENT OF I...
Next Patent: METHOD FOR APPLYING FULUORORESIN ONTO CYLINDER OR COLUMN AND ELASTIC BODY, AND FIXING COMPONENT OF I...