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Title:
RESIN COMPOSITION AND MULTIPLE LAYER-STRUCTURED MATERIAL
Document Type and Number:
Japanese Patent JP2008056766
Kind Code:
A
Abstract:

To provide a resin composition and multiple layer-structured material excellent in gas barrier property under a high humidity, molding processability, productivity and transparency.

This resin composition contains (A) a polyamide containing an aromatic ring in its backbone and (B) a component consisting of 1 kind selected from a specific fatty acid metal salt, a diamide compound, a diester compound, a nonionic surfactant, an anionic surfactant and a cationic surfactant. The multiple layer-structured material having a barrier layer consisting of the resin composition is also provided.


Inventors:
MITADERA ATSUSHI
KATO TOMONORI
KANDA TOMOMICHI
OTAKI RYOJI
Application Number:
JP2006233467A
Publication Date:
March 13, 2008
Filing Date:
August 30, 2006
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
C08L77/06; B32B27/34; B65D1/00; B65D65/40; C08G69/26; C08J7/04; C08K5/00
Domestic Patent References:
JP2001226585A2001-08-21
JP2004131594A2004-04-30
JPH10147711A1998-06-02
JPH1112460A1999-01-19
JP2004352833A2004-12-16
JP2003251775A2003-09-09
JP2003252986A2003-09-10
JPS6436646A1989-02-07
JP2006152288A2006-06-15
JPH10147711A1998-06-02
JPH1112460A1999-01-19
JP2004352833A2004-12-16
JP2003251775A2003-09-09
JP2003252986A2003-09-10
JPS6436646A1989-02-07
JP2006152288A2006-06-15
JP2001226585A2001-08-21
JP2004131594A2004-04-30
Attorney, Agent or Firm:
Takashi Nagai



 
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