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Title:
RESIN COMPOSITION, PHOTOSENSITIVE FILM USING IT, METHOD FOR FORMING RESIST PATTERN, AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2009091458
Kind Code:
A
Abstract:

To provide a phosphorus-containing compound capable of securing sufficient flame retardance without using a halogen-based flame retardant, obtaining a sufficient resolution by alkaline developing liquid, without having the discoloration of surface and blisters at the boundary of copper and a resin on a wiring board in the PCT test, and also sufficiently reducing the problem of bleeding out, a resin composition containing the phosphorus-containing compound, a photosensitive film using the resin composition, a method for forming a resist pattern and a printed wiring board.

This phosphorus-containing compound contains a resin having a repetition unit expressed by a specific chemical formula, (B) a photopolymerizable compound having an ethylene non-saturated group, and (C) a resin compound containing a polymer initiator.


Inventors:
SHINADA EIITSU
ARIGA SHIGEHARU
MORITA MASAKI
HATAKEYAMA SHUICHI
Application Number:
JP2007263344A
Publication Date:
April 30, 2009
Filing Date:
October 09, 2007
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L43/02; C08F230/02; G03F7/004; G03F7/033; H05K3/28
Domestic Patent References:
JP2008274003A2008-11-13
JP2005154702A2005-06-16
JP2007212654A2007-08-23
JP2004101728A2004-04-02
JP2004101728A2004-04-02
JP2007212654A2007-08-23
JP2007182531A2007-07-19
JP2006525407A2006-11-09