Title:
RESIN COMPOSITION FOR PLATING AND PLATED MOLDINGS
Document Type and Number:
Japanese Patent JP2000017138
Kind Code:
A
Abstract:
To provide an improved AES resin composition for plating that can be readily plated under similar conditions to those in plating conventional ABS resins and plated moldings.
This resin composition comprises (A) 10-80 pts.wt. of a graft polymer prepared by grafting an aromatic vinyl and vinyl cyanide onto an ethylene-propylene rubber, (B) 10-60 pts.wt. of a graft polymer prepared by grafting a (meth)acrylic ester or a mixture thereof with other copolymerizable monomers onto a conjugated diene rubber having a weight-average particle size of 0.1-0.4 μm, (C) 10-80 pts.wt. of a copolymer of an aromatic vinyl and vinyl cyanide and (D) 0.01-5.0 pts.wt. of a polyorgnao-siloxane per 100 pts.wt. of (A)+(B)+(C).
Inventors:
ITO MASANORI
EGAWA HIDETOSHI
AOKI HIROMITSU
EGAWA HIDETOSHI
AOKI HIROMITSU
Application Number:
JP20115998A
Publication Date:
January 18, 2000
Filing Date:
June 30, 1998
Export Citation:
Assignee:
SUMIKA ABS LATEX KK
International Classes:
C08L25/04; C08L51/04; C08L83/04; (IPC1-7): C08L51/04; C08L25/04; C08L83/04
Previous Patent: MULTIPHASE COPOLYMER-CONTAINING RESIN COMPOSITION
Next Patent: RESIN COMPOSITION FOR PLATING AND PLATED MOLDINGS
Next Patent: RESIN COMPOSITION FOR PLATING AND PLATED MOLDINGS