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Title:
RESIN COMPOSITION FOR POWDER MOLDING AND MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2009203397
Kind Code:
A
Abstract:

To obtain a resin composition for powder molding, which includes excellent powder fluidity, is excellent in antiblocking properties, hot-melt properties when molded, and the molding of which is excellent in scratch resistance and wear resistance.

The resin composition for powder molding is obtained by sticking 0.01-5 parts weight spherical inorganic particle (E) to 100 parts weight acrylic polymer powder (C) composed of: an acrylic block copolymer (A) which is composed of a methacrylic polymer block (a) based on a methacrylic monomer and an acrylic polymer block (b) based on an acrylic monomer and in which at least one of the methacrylic polymer block (a) and the acrylic polymer block (b) includes an acid anhydride group and/or a carboxy group; and an acrylic polymer (B) having average 1.1 or more reactive functional groups (D) at the least in one molecule.


Inventors:
TAGUCHI YUSUKE
Application Number:
JP2008049142A
Publication Date:
September 10, 2009
Filing Date:
February 29, 2008
Export Citation:
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Assignee:
KANEKA CORP
International Classes:
C08L53/00; B29C41/18; C08F293/00; C08J3/12; C08L33/00; B29K33/00
Domestic Patent References:
JP2007246616A2007-09-27
JP2006274080A2006-10-12
JP2006274079A2006-10-12
JP2006225563A2006-08-31
JP2004010714A2004-01-15
JP2006298708A2006-11-02
Foreign References:
WO2005073269A12005-08-11